2.54mm Pitch Pin Header
2.54mm Pitch Pin Header is available in single, dual, triple and quad rows, spacing between pins is 2.54mm(.100″).
with pin numbers ranging from 1×2 to 1×40, 2×1 to 2×40, 3×1 to 3×40 and 4×1 ~ 4×40, providing reliable connections for circuit boards. Its design makes it suitable for various electronic devices, offering stable and efficient connections between circuit boards and other components.
Vertical, Right Angle, options are available for the 2.54mm Pin Headers. Both Through-Hole (TH) and Surface Mount (SMD) configurations are supported.
Elevated headers are provided to meet the special needs of customer projects, the distance between boards can be customized.
The standard current rating is 3 Amps, dielectric withstanding is 600VAC, and the voltage rating is 250V AC RMS.
Material:
- Insulator: RoHS and REACH compliant PBT, PA6T, LCP
- Pin: Base material – Brass
- Plating: Gold plating over Nickel or Tin, Standard plating thickness – Gold flash (Fu”)
Applications:
- Computer Hardware: Used to connect motherboards and other hardware components, providing reliable electrical connections.
- Embedded Systems: Ideal for connecting various parts of embedded systems, ensuring efficient data transfer.
- Communication Devices: Provides stable and high-speed data transfer channels between devices in the communication field.
- Consumer Electronics: Widely applied in various consumer electronic products, such as TVs, audio systems, and smart devices.
SMT & Thru-Hole Mount Options for 2.54mm Pitch Headers
Surface Mount Technology (SMT) has evolved from traditional Thru-Hole Technology (THT) but is different from THT. From the perspective of assembly technology between Thru-Hole and SMT, the basic difference is that the former requires the lead to be inserted through the hole on the board, while the latter involves laying components on the soldering pad of the board. For SMT assembly, welding spots and headers are positioned on the same side, allowing for pick-up and placement by automated assembly machines. It significantly improves the efficiency of the assembly. Wayconn offers a wide range of 2.54mm SMT Pin Header for various mounting situations.
2.54mm Header Thru-Hole Vertical Mount
2.54mm Header SMT Vertical Mount
2.54mm Header Thru-Hole Right Angle Mount
2.54mm Header SMT Right Angle Mount
Multiple Choice of Numers of Rows
Single and dual row pin headers are commonly used in various electronic products. Triple row and quad row pin headers offer a more compact structure, providing higher connection density. Combining different configurations of pin headers with various mounting methods can better meet the diverse needs of customers.
1Row / Single Row
2 Rows / Dual Rows
3Rows / Triple Rows
4 Rows / Quad Rows
Elevated 2.54mm Pin Header
Elevated Pin Headers, also known as Board Spacers, involve dual insulators stacked together to achieve an ideal space between two PC boards. For example, consider a PC board requiring a 20mm board space. We use an elevated 2.54mm pin header (board spacer) with a stacked height of 10mm, mating with a 10mm profile socket (female header). Wayconn provides various options for insulator height, and by combining them with customized pin length, any required board distance/stacking height can be accommodated.
Packing Options
According to the diverse needs of our customers, we offer multiple packaging options for 2.54mm pitch pin headers to ensure safety during transportation, convenient production processes, and cost-effectiveness.
Loose in Bags: The pin headers are placed in plastic bags, particularly suitable for thru-hole products, making storage and retrieval convenient and Cost-effective.
Tube Packing: Pin headers are placed in plastic tubes, with each segment separated to prevent mixing or damage, meanwhile preventing them from being crushed or damaged during transportation.
Tape and Reel: Tape and reel packaging is an option for automated assembly production line. Pin headers are secured onto special tape, forming a continuous strip. This packaging method is suitable for large-scale production, specially for SMT process and some of the DIP process. Plastic caps and mylar film are optional and serve for automatic picking & placing. With the help of this packing style, automated assembly can improve production efficiency and reduce labor costs.
Whether customers require flexible small-batch orders or large-scale automated production, we can provide suitable packaging options to ensure products are safely and efficiently delivered to meet project requirements.
Documents
Product Specifications