Half-Shielded SMT Offset Series

Half-Shielded Offset RJ45 SMT w/o LED Option, Ultra-Low Profile, Flat PIN, Selective gold plating thickness start from 3u; with Localting Pges, Length x Width x Height: 14.45mm x 15.40mm x 11.40mm, Above PCB Height: 7.50mm, Sinking Plate: 4.1mm;

Product drawing:

Specifications

Material
Housing Material	High Temp Nylon, LCP, UL94V-0
Contact Material	Phosphor Bronze t-0.35mm
Contact Plated	Selective Gold Plating on Contact Area
Gold Plating Thickness	1μ”, 3μ”,6μ”, 15μ”, 30μ”, 50μ”
Shielding	0.2~0.25mm Tin-plated Copper Alloy
Electrical
Voltage Rating	150 V AC RMS
Current Rating	1.5 Amp
Contact Resistance	40mΩ Max.
Insulation Resistance	500MΩ Min. @ 500 VDC
Dielectric Withstanding Resistance	1000 VAC RMS 50Hz/60Hz, 1 Min.
Mechanical
Insertion force	2 contacts=350g 4 contacts=500g 6 contacts=750g 8 contacts=900g 10 contacts=1050g
Retention	7.7kg Between Plug & Receptacle
PCB Retention Force	10 LBS Min.
Durability	750 Mating Cycles Min.
Environmental
Storage Temperature	-40°C to +80°C
Operation Temperature	-40°C to +80°C